Warehouses at the river.

16th IEEE European Test Symposium
May 23-27, 2011

ETS-2011 Logo

Vendor sessions

ETS'11 is offering commercial vendors the opportunity to give technical presentations Vendor Sessions in a track parallel to the technical paper sessions. These presentations will be listed in the symposium program along with the technical sessions, and should be targeted to the ETS technical audience. The Vendor Sessions differ from other ETS presentations in that company names, logos, and product names may be mentioned explicitly. Typical content includes product descriptions, case studies, best practices, and user testimonials.

Presentation opportunities of 30-minute duration are available on a first-come first-served basis, but priority will be given to those companies that are also corporate supporters of ETS'11. Attendance at the sessions is open to all symposium attendees, and vendor representatives will be able to hand out literature at the session. Proposals for the Vendor Sessions should be technical or application focused, rather than overtly sales-and-marketing focused. Proposal selection is based on the technical content and relevance to ETS'11 audience and topics. The areas of interest of ETS'11 include (but are not limited to) the following topics:

  • Analog Test
  • ATE Hardware and Software
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self Test (BIST)
  • Current-Based Test
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability
  • Design for Test(ability) (DfT)
  • Design Verification and Validation
  • Diagnosis and Debug
  • Economics of Test
  • Failure Analysis
  • Fault Modelling and Simulation
  • Fault Tolerance
  • High-Speed I/O Test
  • Memory Test and Repair
  • MEMS Test
  • Microprocessor Test
  • Mixed-Signal Test
  • Nanotechnology Test
  • On-Line Test
  • Power Issues in Test
  • Reliability
  • RF Test
  • Self-Repair
  • Signal Integrity Test
  • Stacked IC Test
  • Standards in Test
  • System Test
  • System-in-Package (SiP) Test
  • System-on-Chip (SoC) Test
  • Test(ability) Synthesis
  • Test of Reconfigurable Systems
  • Test Quality
  • Thermal Issues in Test
  • Yield Analysis and Enhancement

Webmaster: Bjørn B. Larsen, Edited: 11.03.2011 - 10:28.