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Latest News
Symposium booklet is now avalaible
Invited Distinguished Speaker from Group of Dr. Albert FERT, Nobel Prize Laureate in Physics, 2007. See the DETMET program here
ETS on-line registration is now closed. Only on-site registration will be possible, starting from Monday, May 27th, at 13h00.
Presentation slides in ppt format must be uploaded though the MOLE System web site before May 20, 2013
Vendor Sessions - Call for Contributions
ETS'13 is offering commercial vendors the opportunity to give technical presentations in a track parallel to the technical paper sessions. These presentations will be listed in the symposium program along with the technical sessions, and should be targeted to the ETS technical audience. The Vendor Sessions differ from other ETS presentations in that company names, logos, and product names may be mentioned explicitly. Typical content includes product descriptions, case studies, best practices, and user testimonials. Presentation opportunities of 30-minute duration are available: Proposal selection is based on the technical content and relevance to ETS'13 audience and topics. Attendance at the sessions is open to all symposium attendees, and vendor representatives will be able to hand out literature at the session. Proposals for the Vendor Sessions should be technical or application focused, rather than overtly sales-and-marketing focused.
Topics
The areas of interest include (but are not limited to) the following topics.
- Analog Test
- ATE Hardware and Software
- Automatic Test Generation
- Board Test and Diagnosis
- Boundary Scan Test
- Built-In Self Test (BIST)
- Current-Based Test
- Defect-Based Test
- Delay and Performance Test
- Dependability and functional safety
- Design for Test(ability) – DfT
- Design Verification and Validation
- Diagnosis and Debug
- Economics of Test
- Failure Analysis
- Fault Modeling and Simulation
- Fault Tolerance
- High-Speed I/0 Test
- Low-Power IC Test
- Memory Test and Repair
- MEMS Test
- Microprocessor Test
- Mixed-Signal Test
- Nanotechnology Test
- On-line Test
- Power Issues in Test
- Reliability
- RF Test
- Self-Repair
- Signal Integrity Test
- Stacked IC Test
- Standards in Test
- System Test
- System-in-Package (SiP) Test
- System-on-Chip (SoC) Test
- Test(ability) Synthesis
- Test of Reconfigurable Systems
- Test Quality
- Thermal Issues in Test
- Transient and Soft Errors
- Yield Analysis and Enhancement
Vendor Session Submission
A submission to the ETS'13 Vendor Sessions can be an abstract, extended abstract or full paper (max. six pages); submission of a full paper is preferred, but not required. Click here to access the submission system.
- Submission deadline: January 25th 2013
- Notification of acceptance: February 20th 2013
- Final manuscript: April 2nd 2013
Corporate Support
Every year, ETS is financially supported by several companies. The support money is used to reduce the registration fees and hence make the event more accessible to all its attendees. In return, the corporate supporters are allowed to make publicity in various ways. ETS has defined four different support grades (Bronze, Silver, Gold, and Platinum), each with different support amounts and publicity options. To find out more, click here
