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General Info  Program Test Spring School Vendor Sessions Local Information Papers - Posters - Panels | ||||
| When: | Wednesday, May 30th | |||
| Title: | Integrated Diagnostics for the Analysis of Electronic Failures in Vehicles: Project DIANA | |||
| Organizer: | Piet Engelke (Infineon, DE) | |||
| DIANA, a research project funded by the German Federal Ministry of Education and Research, involves AUDI AG, Continental AG, Infineon Technologies AG, and ZMD AG. Together, the four partners are researching ways to improve the analytic and diagnostic capabilities of electronic control units (ECU) in motor vehicles. Assisted by several research organizations and universities, they are working on ways to make error detection more precise, and faults easier to rectify for automakers and repair shops. The ultimate goal is to establish a seamless diagnosis chain, ranging from semiconductor test to the diagnosis at the repair shop. To enable this diagnostic capability in the system, its basis, the integrated circuits (IC), have to provide detailed diagnostic data. This is a radically new requirement which will affect the way in which future automotive ICs are designed and tested. | ||||
| Title: | Introducing MEDIAN: a new COST Action on manufacturable and dependable multicore architectures at nanoscale |
| Organizer: | Marco Ottavi (University of Rome "Tor Vergata", Italy) |
| The MEDIAN project is a COST Action aimed at creating a European network of competence and experts on all dependability aspects of future digital systems development, promoting collaboration between industry and research. The motivation for this project is the reckoning that both technology and architectures are today at a turning point. At the technological level many ideas are being proposed to extend CMOS technology as well as to find alternatives to it like CNTFET, QCA, memristors, etc, and at the architectural level, the spin towards higher frequencies and aggressive dynamic instruction scheduling is being replaced by the trend of including many simpler cores on a single die. These paradigm shifts will require a rethinking of design, manufacturing, testing, and validation of reliable next-generation systems. Manufacturability and dependability issues will be resolved efficiently only with a cross-layer approach that takes into account not only technology, circuit and architectural aspects, but also application scenarios. The project's final goal therefore is to contribute to the constant advances in manufacturing yield and on field reliability that have enabled the pervasive presence of electronic devices pervading our lives by fruitful collaboration and exchange of knowledge between the design and manufacturing side and three different application scenarios: space, medical, and transportation. | |
The ELESIS project addresses these challenges for test and reliability by promoting the development of a framework of embedded test instruments which are controlled through a common interface.
