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ETS General Home
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| Vendor Sessions - Call for Contributions |
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ETS'12 is offering commercial vendors the opportunity to give technical presentations in a track parallel to the technical paper sessions. These presentations will be listed in the symposium program along with the technical sessions, and should be targeted to the ETS technical audience. The Vendor Sessions differ from other ETS presentations in that company names, logos, and product names may be mentioned explicitly. Typical content includes product descriptions, case studies, best practices, and user testimonials.
Presentation opportunities of 30-minute duration are available: Proposal selection is based on the technical content and relevance to ETS'12 audience and topics. Attendance at the sessions is open to all symposium attendees, and vendor representatives will be able to hand out literature at the session. Proposals for the Vendor Sessions should be technical or application focused, rather than overtly sales-and-marketing focused.
Click here to download the Call for Contributions (PDF format)
| | Topics |
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The areas of interest include (but are not limited to) the following topics.
| Analog Test | | Microprocessor Test | | ATE Hardware and Software | | Mixed-Signal Test | | Automatic Test Generation | | Nanotechnology Test | | Board Test and Diagnosis | | On-line Test | | Boundary Scan Test | | Power Issues in Test | | Built-In Self Test (BIST) | | Reliability | | Current-Based Test | | RF Test | | Defect-Based Test | | Self-Repair | | Delay and Performance Test | | Signal Integrity Test | | Dependability | | Stacked IC Test | | Design for Test(ability) - DfT | | Standards in Test | | Design Verification and Validation | | System Test | | Diagnosis and Debug | | System-in-Package (SiP) Test | | Economics of Test | | System-on-Chip (SoC) Test | | Failure Analysis | | Soft Errors | | Fault Modeling and Simulation | | Test(ability) Synthesis | | Fault Tolerance | | Test of Reconfigurable Systems | | High-Speed I/O Test | | Test Quality | | Memory Test and Repair | | Thermal Issues in Test | | MEMS Test | | Yield Analysis and Enhancement |
| | Vendor Session Submissions |
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A submission to the ETS'12 Vendor Sessions can be an abstract, extended abstract or full paper (max. six pages); submission of a full paper is preferred, but not required. Submission instructions can be found here.- Submission deadline (for Vendor Sessions only): January 27th 2012
- Notification of acceptance: February 17th 2012
- Camera-ready manuscript: April 2nd 2012
| | Corporate Support |
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Every year, ETS is financially supported by several companies. The support money is used to reduce the registration fees and hence make the event more accessible to all its attendees. In return, the corporate supporters are allowed to make publicity in various ways. ETS has defined four different support grades (Bronze, Silver, Gold, and Platinum), each with different support amounts and publicity options.
To find out more, click here
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