Vendor session - Call for submissions
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The IEEE European Test Symposium (ETS) is
Europe's premier forum dedicated to presenting and discussing scientific
results, emerging ideas, practical applications, hot topics, and new trends in
the area of electronic-based circuit and system testing. A Test Spring School
will be organized in conjunction with ETS'11.
In 2011 ETS will take place in Trondheim, Norway
and is being organized by the Norwegian University of Science and Technology
(NTNU) and sponsored by the Test Technology Technical Council (TTTC) of the
IEEE Computer Society. Norway is known for its white summer nights; during the
week of ETS'11 the sun will rise in Trondheim well before 4am and set close to
11pm.
ETS’11 is offering commercial vendors the
opportunity to give technical presentations in a track parallel to the
technical paper sessions. These presentations will be listed in the symposium
program along with the technical sessions, and should be targeted to the ETS
technical audience. The Vendor Sessions differ from other ETS presentations in
that company names, logos, and product names may be mentioned explicitly.
Typical content includes product descriptions, case studies, best practices,
and user testimonials.
Presentation opportunities of 30-minute duration
are available on a first-come first-served basis, but priority will be given to
those companies that are also corporate supporters of ETS’11 – see
below. Attendance at the sessions is open to all symposium attendees, and
vendor representatives will be able to hand out literature at the session.
Proposals for the Vendor Sessions should be technical or application focused,
rather than overtly sales-and-marketing focused. Proposal selection is based on
the technical content and relevance to ETS’11 audience and topics. The
areas of interest of ETS’11 include (but are not limited to) the following
topics:
- Analog Test
- ATE Hardware and Software
- Automatic Test Generation
- Board Test and Diagnosis
- Boundary Scan Test
- Built-In Self Test (BIST)
- Current-Based Test
- Defect-Based Test
- Delay and Performance Test
- Dependability
- Design for Test(ability) (DfT)
- Design Verification and Validation
- Diagnosis and Debug
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- Economics of Test
- Failure Analysis
- Fault Modelling and Simulation
- Fault Tolerance
- High-Speed I/O Test
- Memory Test and Repair
- MEMS Test
- Microprocessor Test
- Mixed-Signal Test
- Nanotechnology Test
- On-Line Test
- Power Issues in Test
- Reliability
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- RF Test
- Self-Repair
- Signal Integrity Test
- Stacked IC Test
- Standards in Test
- System Test
- System-in-Package (SiP) Test
- System-on-Chip (SoC) Test
- Test(ability) Synthesis
- Test of Reconfigurable Systems
- Test Quality
- Thermal Issues in Test
- Yield Analysis and Enhancement
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Submissions
A submission to the ETS’11 Vendor Sessions
can be an abstract, extended abstract or full paper (max. six pages);
submission of a full paper is preferred, but not required. Proposals should be
submitted via the ETS’11 website; detailed submissions instructions can
also be found there (go to http://www.ieee-ets.org, follow the link to
ETS’11, and then select Submission
Instructions).
Key dates for submissions:
- Submission deadline (for Vendor Sessions
only): January 28, 2011
- Notification of acceptance: February 15,
2011
- Camera-ready manuscript: March 15, 2011
ETS’11 Corporate Support
Every year, ETS is financially supported by
several companies. The support money is used to reduce the registration fees
and hence make the event more accessible to all its attendees. In return, the
corporate supporters are allowed to make publicity in various ways. ETS has
defined four different support grades (Bronze, Silver, Gold, and Platinum),
each with different support amounts and publicity options. To find out more,
contact Erik Jan Marinissen or Knut Båtstoløkken, details below.
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